Precision Laser Cutting on a Silicon Wafer. The laser head is focused on the wafer, performing intricate cuts required for semiconductor manufacturing. 图片
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Precision Laser Cutting on a Silicon Wafer. The laser head is focused on the wafer, performing intricate cuts required for semiconductor manufacturing.
素材ID:974637257

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  • 格式:JPG
  • 作者:vladimir
  • 最大分辨率:5824 x 3264px
  • 最大输出:49.31 x 27.64cm (300dpi) | 205.46 x 115.15cm (72dpi)

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